High-density 3-dimensional structure
US8710598B2 · kind B2 · utility
4Cited by
1References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 1, 2009 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jul 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A 3-D structure formed in a recess of a substrate delimited by walls, including a large number of rectangle parallelepipedic blades extending from the bottom of the recess to the substrate surface while being oriented perpendicularly to one another and formed in a pattern covering the whole surface of the recess, some blades being non-secant to one of the walls, each non-secant blade being connected to one of the walls by at least another perpendicular blade.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.