Die seal ring
US8710616B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2009 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Aug 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved die seal ring is described which includes at least one break. In the region of the break in the die seal ring, the doping is modified so that the impedance of the electrical path across the break through the substrate is increased. Offsets in the break may also be used and the offset may be within a break in a track and/or between breaks in different tracks, where the die seal ring includes more than one track.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.