Hermetically sealed atomic sensor package manufactured with expendable support structure
US8710935B2 · kind B2 · utility
1Cited by
10References
20Claims
0Family size
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Key dates
| Filing date | Sep 24, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.