Method for assembling a camera module, and camera module
US8711277B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 26, 2007 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jul 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a camera module is provided, the camera module including a lens and an image sensor chip, the image sensor chip being electrically contacted to a circuit board. After a first fitting part that surrounds the image sensor chip is positioned and secured on the circuit board, the first fitting part is joined to a second fitting part disposed on the housing of the camera module, forming an overlap region. A focus position between the housing-side lens and the image sensor chip is produced, and a materially attached connection is then generated between the fitting parts within the overlap region, in the focus position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.