Chip sorting apparatus

US8714227B2 · kind B2 · utility

Assignee

• Epistar Corporation · TW

Inventors

• Chen-ke HSU · Xiamen, CN
• Liang-Sheng Chi · Hsinchu, TW
• Chun-Chang Chen · Tainan, TW
• Win-Jim Su · 東區, TW
• Hsu-Cheng Lin · Hsinchu, TW
• Mei-Ling Tsai · Hsinchu, TW
• Yi Lung Liu · Hsinchu, TW
• Chen Ou · Hsinchu, TW

Key dates

• Filing date: Jul 23, 2010
• Grant date: May 6, 2014
• Expiry date: Apr 20, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1983
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.