Cooling apparatus for cooling a power electronic device
US8714302B2 · kind B2 · utility
5Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2012 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Jul 6, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F13/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.