Configurable enclosure for electronics components
US8714667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2008 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Dec 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T292/1086
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Enclosures for electronic components and methods for manufacturing the same are shown. In one embodiment, the enclosure includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall defining an interior space of the enclosure. A first mounting channel and a second mounting channel can be coupled to each one of the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall. A side channel can be removably coupled to the first mounting channel and the second mounting channel. A mounting panel can be removably coupled to the side channel, the mounting panel providing a flat surface extending away from the side channel towards a sidewall opposite a sidewall nearest the side channel and adapted to support electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.