Fungicidal compositions including hydrazone derivatives and copper
US8715745B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2010 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Apr 9, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C323/36
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to the use of hydrazone compounds and copper for controlling the growth of fungi.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.