Adhesive composition for a debondable self-adhesive label
US8715797B2 · kind B2 · utility
2Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2008 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Mar 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot-melt pressure-sensitive adhesive (HMPSA) composition is disclosed comprising: Also disclosed are a multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. A self-adhesive label and process for recycling a labeled article with debonding of said label by immersing the article in a hot basic aqueous solution are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.