Transferring structure for flexible electronic device and method for fabricating flexible electronic device
US8715802B2 · kind B2 · utility
10Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2009 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Apr 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.