Resin composition for forming fine pattern and method for forming fine pattern
US8715901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2005 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Apr 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0274
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin composition which, in forming a fine pattern by a heat treatment of a resist pattern formed by using a photoresist, can be applied onto the resist pattern, can cause the resist pattern to smoothly shrink by heat treatment, and can be easily washed away by a treatment with an alkaline aqueous solution, and a method for efficiently forming a fine resist pattern using the resin composition are provided. The resin composition comprises a resin containing a hydroxyl group, a crosslinking component, and an alcohol solvent containing water in an amount of 10 wt % or less for the total solvent, wherein the alcohol in the alcohol solvent is a monovalent alcohol having 1 to 8 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.