Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die
US8716140B2 · kind B2 · utility
3Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2012 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Jul 23, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.