Photosensor chip package structure
US8716722B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2012 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Aug 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photosensor chip package structure comprises a substrate, a light-emitting chip and a photosensor chip including an ambient light sensing unit and a proximity sensing unit. The substrate has a first basin, a second basin and a light-guiding channel. The openings of the first and second basins respectively face different directions. One opening of the light-guiding channel and the opening of the first basin face the same direction. The other opening of the light-guiding channel interconnects with the second basin. The light-emitting chip is arranged in the first basin. The photosensor chip is arranged in the second basin. The light-guiding channel conducts the light generated by the light-emitting chip and the ambient light to the photosensor chip. The photosensor chip operates as soon as it receives the light generated by the light-emitting chip and/or the ambient light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.