Light emitting diode package having a portion of reflection cup material covering electrode layer on side surfaces of substrate
US8716734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2011 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Jun 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.