Microelectronic chip, component containing such a chip and manufacturing method
US8716843B2 · kind B2 · utility
0Cited by
9References
7Claims
0Family size
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Key dates
| Filing date | Apr 25, 2012 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Jun 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic chip including a semiconductor substrate; at least one area of its surface which is suitable to be electrically connected to a metal frame designed to accommodate the chip; at least one interconnect area formed by a copper-based conductive layer and comprising a connecting device, the interconnect area being connected to the area by a conductor, wherein the area is formed by a layer forming a copper diffusion barrier inserted between interconnect area and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.