Die including a groove extending from a via to an edge of the die

US8718720B1 · kind B1 · utility

Assignee

• TriQuint Semiconductor, Inc. · US

Inventors

• Shixi Louis Liu · Milpitas, US
• Wenlong Ma · Fremont, US
• Frank Hin-Fai Chau · Fremont, US
• Barry Jia-Fu Lin · Cupertino, US

Key dates

• Filing date: Jul 30, 2010
• Grant date: May 6, 2014
• Expiry date: Jan 6, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/10155
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments include but are not limited to apparatuses and systems including a die or a preform including at least one groove configured to extend from at least one via of the die to an edge of the die. Other embodiments may be described and claimed.