Housings for implantable medical devices and methods for forming housings
US8718774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2010 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Jun 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Described herein is an implantable medical device and methods for making a device that includes a metal housing a molding process. In one embodiment, the housing includes a header attachment element extends from the housing. In another embodiment, the implantable medical device includes a header attachment surface comprising one or more header retaining features configured to secure a connector header to the header attachment surface. In another embodiment, the housing includes one or more structural elements extending from and integrally molded with the interior surface of the first or second portions of the housing. Also disclosed are methods of making the implantable medical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.