Method and system for utilizing low power superspeed inter-chip (LP-SSIC) communications
US8719475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2011 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Jul 17, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Inter-chip connectivity may be provided in a computing device, which may comprise a USB host and at and at least one USB device embedded within the computing device, based on Universal Serial Bus version 3.0 (USB3.0) interface. In this regard, internal communication of data between the USB host and embedded USB device may be performed via USB3.0 SuperSpeed signals. The USB host and/or the USB3.0 interface may be configured to enable USB3.0 internal communication of data, and to reduce power consumption during the internal communication of data compared to external USB3.0 communications. Configuration of the USB3.0 interface for internal communication of data may comprises modifying and/or adjusting physical (PHY) layer, link layer, and/or protocol layer related parameters, functions, resources, and/or operations. The USB3.0 SuperSpeed signals may be communication using scalable low voltage signaling (SLVS). In this regard, Input/Output (IO) Swing may be set based on loopback training sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.