Patent · US Active

Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder

US8720429B2 · kind B2 · utility

18Cited by
15References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 28, 2010
Grant dateMay 13, 2014
Priority date
Expiry dateFeb 4, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/9292
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120,130) is that the application of a metallic binder layer (30) can be avoided. Metallic binder layers add to the cost of a fixed abrasive sawing wire and in many cases pose health and safety problems which can be avoided by the use of an organic binder layer. Moreover the advantages of a good fixture of the abrasive particles in the metallic wire are maintained. Different embodiments are presented with different degrees of embedment into the metal wire.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.