Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder
US8720429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2010 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Feb 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120,130) is that the application of a metallic binder layer (30) can be avoided. Metallic binder layers add to the cost of a fixed abrasive sawing wire and in many cases pose health and safety problems which can be avoided by the use of an organic binder layer. Moreover the advantages of a good fixture of the abrasive particles in the metallic wire are maintained. Different embodiments are presented with different degrees of embedment into the metal wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.