Cutting element and a method of manufacturing a cutting element
US8720612B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2009 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jul 26, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2005/001
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure relates in one aspect to a cutting element comprising a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer comprises an ultra hard material. The substrate comprises tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80% to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80% to less than 85%. Also included are drill bits incorporating such cutting elements. Additionally, the present disclosure relates to methods of manufacturing cutting elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.