Sidewall and method for bonding sidewall panels
US8720974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | May 23, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for bonding sidewall panels each comprising first and second skins and a core member sandwiched therebetween. The first skin has a main portion and an overlapping portion extending beyond the core member. The second skin has a main portion and an overlapped portion not extending beyond the core member. The method comprises the following steps. First, an entire exterior surface of the first skin and only an exterior surface of the main portion of the second skin of each of said sidewall panels are painted. Then, the sidewall panels are oriented such that the overlapping portion of the first skin of one sidewall panel is planarly aligned with the overlapping portion of the second skin of another sidewall panel. Next, the overlapping portion of the first skin of one sidewall panel is adhesively bonded to the overlapped portion of the second skin of another sidewall panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.