LGF plate-to-plate manufacturing method and structure thereof
US8721148B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Nov 1, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0065
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A LGP plate-to-plate manufacturing includes the steps of: preparing an optical substrate with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the optical substrate; coating an optical layer on the first or second surface of the optical substrate; and curing the optical layer to directly form a second microstructure on the first or second surface of the optical substrate; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide plate structure. In an embodiment, an additional optical layer is provided on the optical substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.