Optical component
US8721191B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 2, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Aug 2, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/1204
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312), a second PLC waveguide (313), and a fiber alignment member (314), a mount (320), and optical fibers (330). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.