Heat sink socket
US8721359B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Oct 18, 2013 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Oct 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/111
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat sink socket for cooling electronic devices has a heat conducting body having an upper surface for receiving an electrical component and a lower surface for engaging a supporting circuit board. An insulated terminal has an electrical insulating body supporting a first electrical terminal within the heat conducting body. The first electrical terminal connects an electrical contact of the electrical component to the circuit board. The heat sink socket may include a ground plane on the heat conducting body. The ground plane may have a second electrical terminal that connects an electrical contact of the electrical component to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.