Abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making
US8721395B2 · kind B2 · utility
2Cited by
4References
17Claims
0Family size
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Inventors
Key dates
| Filing date | Jul 16, 2010 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jul 16, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.