Automated microdissection instrument

US8722357B2 · kind B2 · utility

Assignee

• Life Technologies Corporation · US

Inventors

• Thomas M. Baer · Mountain View, US
• Michael Youngquist · Palo Alto, US
• Brian W. Donovan · San Jose, US
• Alan E. Wessel · Mountain View, US
• Norbert Leclerc · Heidelberg, DE
• Michael A. Smith · Phoenix, US
• George M. Dawson · Los Gatos, US
• Craig S. Barker · San Carlos, US

Key dates

• Filing date: Sep 26, 2005
• Grant date: May 13, 2014
• Expiry date: Dec 15, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1054
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.