Manufacturing process for solid state lighting device on a conductive substrate
US8722441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2012 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jun 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
Abstract
A method for fabricating a light emitting device includes forming a trench in a first surface on first side of a substrate. The trench comprises a first sloped surface not parallel to the first surface, wherein the substrate has a second surface opposite to the first surface of the substrate. The method also includes forming alight emission layer over the first trench surface, but not over the remainder of the first substrate surface, and removing at least a portion of the substrate from the second side of the substrate to expose the light emission layer and allow it to emit light out of the protrusion or protrusions on the second side of the substrate. These protrusions may be elongated pyramids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.