Patent · US Active

Polymer composition for injection moulding

US8722807B2 · kind B2 · utility

2Cited by
4References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 2, 2005
Grant dateMay 13, 2014
Priority date
Expiry dateMay 1, 2027

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/03
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The application relates to a polyethylene composition having a base resin, the base resin comprising (A) a first polyethylene fraction, and (B) a second polyethylene fraction, wherein the melt flow rate MFR5/190° c. of the first fraction is higher than the melt flow rate MFR5/190° c. of the second fraction, the flow rate ratio FRR21/5 of the polyethylene composition, defined as the ratio of melt flow rate MFR21-6/190° c. to melt flow rate MFR5/190° c., is within the range of 15-28, and 10 the melt flow rate MFR5/190° c. of the polyethylene composition is within the range of 0.5-1.1 g/10 min.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.