Polymer composition for injection moulding
US8722807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2005 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | May 1, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The application relates to a polyethylene composition having a base resin, the base resin comprising (A) a first polyethylene fraction, and (B) a second polyethylene fraction, wherein the melt flow rate MFR5/190° c. of the first fraction is higher than the melt flow rate MFR5/190° c. of the second fraction, the flow rate ratio FRR21/5 of the polyethylene composition, defined as the ratio of melt flow rate MFR21-6/190° c. to melt flow rate MFR5/190° c., is within the range of 15-28, and 10 the melt flow rate MFR5/190° c. of the polyethylene composition is within the range of 0.5-1.1 g/10 min.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.