Conductor grid for electronic housings and manufacturing method
US8723032B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2010 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Oct 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.