Printed circuit board, design method thereof and mainboard of terminal product
US8723047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2008 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Nov 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09627
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines on an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.