Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies
US8723052B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2013 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Feb 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, a system includes a conductor on a first layer of a laminated composite assembly. The laminated composite assembly has an input, an output, a first electrical interconnect which couples the conductor on the first layer of the laminated composite assembly with a second conductor on a second layer of the laminated composite assembly, and a second electrical interconnect which electrically couples the first conductor with the second conductor. A width of the second electrical interconnect is greater than a width of the first electrical interconnect. A resistance of the laminated composite assembly as measured between the electrical input and the electrical output is less than the resistance of the laminated composite assembly as measured between the electrical input and the electrical output if the width of the first electrical interconnect were substantially equal to the width of the second electrical interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.