On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
US8723076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2012 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jun 28, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.