Method of cutting single crystals
US8723288B2 · kind B2 · utility
0Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Sep 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A single crystal having a technologically generated cleavage surface that extends along a natural crystallographic cleavage plane with an accuracy of less than |0.001°| when measured over a length relevant for the technology of the single crystal or over each of a plurality of surface areas extending in the direction of separation and having a length ≧2 mm within the technologically relevant surface area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.