Patent · US Active

Method of cutting single crystals

US8723288B2 · kind B2 · utility

0Cited by
7References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 7, 2011
Grant dateMay 13, 2014
Priority date
Expiry dateSep 7, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31678
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A single crystal having a technologically generated cleavage surface that extends along a natural crystallographic cleavage plane with an accuracy of less than |0.001°| when measured over a length relevant for the technology of the single crystal or over each of a plurality of surface areas extending in the direction of separation and having a length ≧2 mm within the technologically relevant surface area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.