Methods of creating probe structures from a plurality of planar layers
US8723543B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Mar 4, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06711
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip, a compliant body, and a bonding material that can be used in bonding the probe to a substrate and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.