Liquid cooling system for a server
US8724315B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | May 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.