Heat dissipation structure
US8724326B2 · kind B2 · utility
4Cited by
2References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 26, 2012 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Aug 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.