Fiber to wafer interface
US8724937B2 · kind B2 · utility
38Cited by
18References
25Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 20, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jul 29, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/138
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.