Stress sensor and its manufacturing method
US8726738B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 22, 2010 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Nov 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49103
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for measuring deformation including: a) at least one strain gauge, producing a signal following a deformation, positioned on a face of a flexible support favoring elongation of the strain gauge, the face opposite the strain gauge of the flexible support, which is configured to be brought into contact with, or glued to, a test body with the deformation desired to be measured; b) at least one first substrate, including at least signal processor and/or signal transmission device; c) a securing mechanism to assemble the strain gauge and the first substrate mechanically, including an elastic layer of material having elastic properties positioned between the gauge and the first substrate, the elastic layer preventing deformation of the gauge from being transmitted, or be transmitted as little as possible, to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.