Die bonder and bonding method
US8727202B2 · kind B2 · utility
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2References
7Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 15, 2012 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Aug 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.