Methods for manufacturing porous orthopaedic implants
US8727203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2010 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jun 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12806
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.