Die plate for resin granulation
US8727762B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2012 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jun 18, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In order to ensure quality of pellets by eliminating temperature differences among extrusion nozzle holes with use of a heating medium flowing through heating channels only once and flowing out through a heating medium outlet, provided is a die plate for resin granulation, in which a plate main body (1) is divided into regions (A to n) for every 360/n (n=4, 6, or 8) degrees, or into first to fourth regions (A to D) for every 90 degrees, and an inner annular heating passage (4) and an outer annular heating passage (5) are formed. A heating medium (F) supplied through a heating medium inlet (2) flows through heating channels (8) only once, and then flows out through a heating medium outlet (3) to an outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.