Preparing electrodes for electroplating

US8728293B2 · kind B2 · utility

Assignee

• The United States of America, as represented by the Secretary of the Navy, Naval Research Laboratory · US

Inventors

• F. Keith Perkins · Alexandria, US
• Perry Skeath · Tucson, US
• Lee James Johnson · Edina, US
• John R. Peele · Alexandria, US
• William W. Bassett · Wheaton, US

Key dates

• Filing date: Feb 8, 2013
• Grant date: May 20, 2014
• Expiry date: Feb 8, 2033

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D21/04
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid. Alternatively, carbon dioxide can be used as an immersion liquid, in which case the liquid carbon dioxide may be obtained by adjusting the temperature and pressure conditions in a closed container of gaseous carbon dioxide.