Patent · US Active

Multi-component adhesive system

US8728602B2 · kind B2 · utility

0Cited by
25References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 28, 2008
Grant dateMay 20, 2014
Priority date
Expiry dateJul 5, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/28
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Adhesive systems may be fabricated to include first and second solid adhesion structures. The first adhesion structure may require an applied normal preload force to achieve adhesion to a surface. The second solid adhesion structure may be separate from but joined to the first adhesion structure such that both adhesion structures are jointly adherable to the surface upon application of the normal preload force.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.