Manufacturing process and heat dissipating device for forming interface for electronic component
US8728872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2011 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Aug 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.