Ultra-high solids emulsion pressure sensitive adhesives and their applications
US8729157B2 · kind B2 · utility
1Cited by
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3Claims
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Key dates
| Filing date | Mar 29, 2010 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Aug 4, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/26
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for making an ultra high solids emulsion adhesive that is coatable and dryable at room temperature. The process consists of increasing solids using a phase inversion process to accomplish the addition of increased solids into aqueous formulations thereby obtaining emulsion pressure sensitive adhesives with solids content in excess of 60%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.