Polymer composition for microelectronic assembly
US8729166B2 · kind B2 · utility
2Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2013 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Sep 27, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0033
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.