Epoxy structural adhesive
US8729197B2 · kind B2 · utility
11Cited by
7References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 19, 2011 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jul 19, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.