Microbolometer contact systems and methods
US8729474B1 · kind B1 · utility
3Cited by
19References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2009 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Nov 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/805
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are directed to contacts for an infrared detector. For example, an infrared imaging device includes a substrate having a first metal layer and an infrared detector array coupled to the substrate via a plurality of contacts. Each contact includes for an embodiment a second metal layer formed on the first metal layer; a third metal layer formed on the second metal layer, wherein the third metal layer at least partially fills an inner portion of the contact; and a first passivation layer formed on the third metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.