Patent · US Active

Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts

US8729591B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

TSMC SOLID STATE LIGHTING LTD. · TW

Inventors

Jochen Kuhmann · Berlin, DE
Lior Shiv · Yoqneam Illit, IL

Key dates

Filing date	Apr 20, 2009
Grant date	May 20, 2014
Priority date	—
Expiry date	Jul 14, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Non-planar via designs for sub-mounts on which to mount a LED or other optoelectronic device include a continuous layer of metal to conduct the current from the front-side (e.g., LED side) to the backside (e.g., SMD side) through the via and to provide a sufficiently stable and reliable under bump metallization for SMD soldering. Each UBM can be structured so that it does not fully cover the sidewall surfaces of the via that forms the front-to-backside interconnect. In some implementations, each via structure for the feedthrough metallization extends to a respective side-edge of the sub-mount.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.