Capacitance touch panel module and fabrication method thereof
US8729910B2 · kind B2 · utility
4Cited by
0References
14Claims
0Family size
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Key dates
| Filing date | Mar 5, 2010 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jan 7, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention discloses a method of fabricating a capacitance touch panel module. The method includes providing a substrate with a touching area and a peripheral area; forming a plurality of first conductive patterns on the substrate along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covers one connecting portion; forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.